XG8 Series

Client SSD


The XG8 Series utilizes KIOXIA latest 112-layer, 3D TLC (3-bit-per-cell) flash memory. With 5th generation BiCS FLASH™ and SLC cache features, XG8 SSDs reach up to sequential read/write speeds of 7,000 MB/s and 5,800 MB/s respectively and deliver up to 900K random read and 620K random write IOPS. The power consumption of XG8 Series is 8.1 W or less in active mode and less than 3 mW in stand-by mode.

The new XG8 Series is optimized for power-sensitive mobile PCs, performance-oriented gaming PCs, as well as data center environments for server-boot, caching and logging.

Available in a compact M.2 Type 2280 form factor, the XG8 Series comes in four capacity models of 512 GB, 1,024 GB, 2,048 GB and 4,096 GB, each with the option of a Self-Encrypting Drive (SED) model supporting TCG Opal Version 2.01.

 

 

Key Features
  • KIOXIA 112-Layer BiCS FLASH™
  • PCIe® 4.0, NVMe™1.4
  • Capacities up to 4,096 GB
  • M.2 Type 2280 Single-sided (512 GB, 1,024 GB, 2,048 GB) / Double-sided(4,096 GB)
  • TCG Opal 2.01 Optional for SED
Applications
  • Thin performance notebook PCs
  • High-performance desktop PCs
  • Gaming PCs
  • Server-boot, caching & logging use in data center

Documents

Specifications

Base Model NumberKXG80ZN84T09KXG80ZNV2T04KXG80ZNV1T02KXG80ZNV512G
SED Model NumberKXG8AZN84T09KXG8AZNV2T04KXG8AZNV1T02KXG8AZNV512G
Capacity4,096 GB2,048 GB1,024 GB512 GB
Basic Specifications
Form FactorM.2 2280-D2 Double-sidedM.2 2280-S2 Single-sided
Connector TypeM.2 M
lnterfacePCIe® 4.0, NVMe™ 1.4
Maximum Interface Speed64 GT/s ( Gen4 x4 )
Flash Memory TypeBiCS FLASH™ TLC
Sequential Read7,000 MB/s
Sequential Write5,800 MB/s5,600 MB/s5,000 MB/s
Power Requirements
Supply Voltage3.3 V ± 5 %
Power Consumption (Ready)8.1 W typ.7.7 W typ.
Power Consumption (L1.2 mode)3.0 mW typ.
Reliability
MTTF1,500,000 hours
Dimensions
Height3.58 mm Max2.23 mm Max
Width22.0 ± 0.15 mm
length80.0 ± 0.15 mm
Weight8.3 g Max7.1 g Max6.8 g Max6.6 g Max
Environmental
Temperature (Operating)0 °C to 95 °C (Controller Temperature)
Temperature (Operating)0 °C to 85 °C (Other Components Temperature)
Temperature(Non-operating)-40 °C to 85 °C
Humidity (Operating)0 % R.H. to 90 % R.H.
Vibration (Operating/Non-operating)196 m/s2 { 20 G } ( Peak, 20 to 2,000 Hz )
Shock (Operating)14.7 km/s2 { 1,500 G } ( 0.5 ms )
  • Product image may represent a design model.
  • Availability of the SED model line-up may vary by region.
  • Definition of capacity: KIOXIA Corporation defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1GB = 2^30 = 1,073,741,824 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, such as Microsoft Operating System and/or pre-installed software applications, or media content. Actual formatted capacity may vary.
  • MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean failure rates for a large number of products which may not accurately reflect actual operation. Actual operating life of the product may be different from the MTTF.
  • Read and write speed, tested on the state of "SLC cache=ON", may vary depending on the host device, read and write conditions, and file size.
  • PCIe is a registered trademark of PCI-SIG.
  • NVMe is a registered or unregistered mark of NVM Express, Inc. in the United States and other countries.
  • Other company names, product names, and service names may be trademarks of their respective companies.